Comparison ledger
Mydata MY 12, Mydata MY 12 E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MY 12Mydata | MY 12 EMydata |
|---|---|---|
| OEM | Mydata | Mydata |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Mydata MY 12 | Mydata MY 12 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 50/60 Hz[2] | 50/60 Hz[1] |
| Type | pick and place machine[3] | — |
| Category | Assembly / SMT[3] | — |
| Power / electrical | 50/60 Hz[3] | — |
| Placement rate, standard performance | 6,500 CPH[4] | — |
| HYDRA Speedmount placement rate on chips | 21,000 CPH[4] | — |
| Linescan Vision System placement rate on fine-pitch components | 6,100 CPH[4] | — |
| Accuracy | Repeatability of 15 mm at 3 sigma[4] | — |
| Feeder capacity | 144 x 8 mm tapes or 135 SOIC tubes or 112 x 8 mm tapes and 32 JEDEC trays (with TEX)[4] | — |
| Rated speed | 21,000 CPH IPC 9850 chip net throughput 17,500 CPH[5] | — |
| Fine-pitch rated speed | 6,100 CPH IPC 9850 fine pitch net throughput 1,500 CPH[5] | — |
| Board handling: maximum board size | 384 x 508 mm, 563 x 508 mm, 745 x 610 mm, or 932 x 732 mm depending on configuration[5] | — |
| Machine size | 3360 mm length, 1450 mm height, 2000 mm depth, 2134 mm depth, or 2378 mm depth depending on configuration[5] | — |
| Weight | 2100 kg[5] | — |
| Power requirements | Three phase AC 6.6 kVA (3 x 2.2 kVA)[5] | — |
| Power | — | 50/60 Hz[6] |
| Vintage | — | 2006[7] |
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