Waferpedia

Comparison ledger

DW 288 S 4 DiamondversusWSD K 3

Meyer Burger DW 288 S 4 Diamond, Takatori WSD K 3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Dicing & Grinding, null[1]
Side-by-side comparison of selected equipment models
Attribute
DW 288 S 4 DiamondMeyer Burger
WSD K 3Takatori
OEMMeyer BurgerTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyMeyer Burger DW 288Takatori WSD K 3
Specifications
ConfigurationWire Management System WM2[2]Capable of handling substrates that include:[1]
Operating hours of Mc18,534 hours[2]—
Operating hours of automatic Mc453 hours[2]—
Operating hours of main drive534 hours[2]—
13112403/2Way Solenoid Valve DN4 reference 10040439 (1)[2]—
1310366Cutting Fluid additive ADDITIVEA33 ref BLASER 29106020001 (1)[2]—
1310362Beam DMT710 420x50x16mm 100mm radius ref 10266500 (95)[2]—
1310361Beam DMT710 420x50x16mm 75mm radius ref 10266493 (175)[2]—
1310363Beam DMT710 carre 156 420x156x16mm ref 10266501 (95)[2]—
1310364Fil diamante 12 PLAU, 60KM, MB50 ref 12PLAU0F31560A (6)[2]—
ManufacturerMeyer Burger[2]—
ModelDW 288 S 4[2]—
CategoryDicing & Grinding[3]—
Machine typeMulti Wire Saw[4]—
ApplicationSmart slicing technology for sapphire, and other hard and brittle materials[4]—
ProcessSlicing semiconductor silicon and sapphire into wafer[4]—
Work piece dimensionsMax. Ø 8″ × 420 mm or ≤ 210 × 420 mm[5]—
Web length420 mm[5]—
Wire speed25 m/s (1500 m/min)[5]—
Wire acceleration8 m/s² (< 4 s)[5]—
Min. wire diameter100 μm[5]—
Max. wire tension45 N[5]—
Rocking principleRocking of work piece[5]—
Rocking angle± 12°[5]—
Wire guide roller axis distance540 mm[5]—
Cutting fluid tank240 l[5]—
Machine dimensions3620 × 1780 × 3010 mm[5]—
Machine weight10500 kg[5]—
Power & electricalStandard Europe power management (400V, 230V Schuko plugs)[3]—
US electrical conversionUL conversion and voltage conversion (480V, 110V plugs)[3]—
Wire management systemWM2[2]—
Cutting fluid media moduleSaphir cutting fluid media module with long filter[2]—
Cutting fluid manifoldWithout regulation valves, 1 mechanical flow meter, and flow bars[2]—
Tank drainWith hand valve[2]—
1310135Sock Filter P01 micron 25L ref 10040184 (50)[2]—
1310365Cutting Fluid SYNERGY DWS300 ref Blaser 17300010025 (6)[2]—
1311236Force transducer 100N Diam=36 reference 10240940 (1)[2]—
1311243Insert sleeve E 15/12x reference 79260 (2)[2]—
1311237Level sensor LFP0400-A4NMB L 360 reference 10116033 (1)[2]—
1311234O ring NBR70 222x5 reference 10015299 (2)[2]—
1311232O ring NBR75 240x3 reference 10037880 (2)[2]—
1310136Pulley Diameter 156,6 reference 10101530 (42)[2]—
1311231Precision ball reference 10075759 (4)[2]—
1316934Resistance bac ultrason Ref 10167_88 (5)[2]—
1311238Temperature sensor D4x57 reference 10075173 (2)[2]—
ApplicationsSapphire, ceramics, quartz, other hard and brittle materials[4]—
Operating hours of machine18,534 hours[2]—
Operating hours of automatic machine453 hours[2]—
PowerStandard Europe power management (400V, 230V Schuko plugs)[2]—
Capable substrates—Silicon Carbide (SiC), Sapphire, Quartz crystal and optical materials, Compound semiconductors (GaAs, GaN, InP)[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]lapmaster-wolters.comlapmaster-wolters.com
  5. [5]precision-surface.comprecision-surface.com