Comparison ledger
Logitech PM5, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PM5Logitech | 108TPR Hoffman |
|---|---|---|
| OEM | Logitech | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | 100mm | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech PM5 | PR Hoffman 108T |
| Specifications | ||
| Manufacturer | Logitech[1] | — |
| Model | PM5[1] | — |
| Application | Polishing and lapping[1] | — |
| Abrasive autofeed cylinder compatibility | Abrasive autofeed cylinder for use with a Logitech PM5 or LP50 system[2] | — |
| Sample wafer size | 4 inch (100mm) or smaller[3] | — |
| Power supply voltage | Single phase AC100V[3] | — |
| Machine type | Lapping and polishing system[3] | — |
| Number of workstations | Single[4] | — |
| Wafer size | 100 mm (4 inches) or smaller[3] | — |
| Polishing plate material | Stainless steel[3] | — |
| Lapping plate material | Cast iron[3] | — |
| Sample holding method | Vacuum[3] | — |
| Variable plate speed | Yes[3] | — |
| Slurry delivery method | Peristaltic pump[3] | — |
| Roller arm assembly | Yes[3] | — |
| Emergency stop | Yes[3] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[5] |
| machine class | — | for double-sided planetary lapping & polishing machines[5] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[5] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[5] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[6] |