Waferpedia

Comparison ledger

1 DP 41versus108T

Logitech 1 DP 41, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1 DP 41Logitech
108TPR Hoffman
OEMLogitechPR Hoffman
CategoryCMPCMP
Wafer size—up to 12 in wafers
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 DP 41PR Hoffman 108T
Specifications
Phase3 Phase[1]—
Configuration50/60 Hz[1]—
Voltage480 V[1]—
MakeLogitech[1]—
Model1 DP 41[1]—
Frequency50/60 Hz[1]—
Current12 amps[1]—
carrier type listing—108T 9B - S/F / Lapmaster LSP-9 / etc.[2]
machine class—for double-sided planetary lapping & polishing machines[2]
wafer sizes stated on insert-carrier page—3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[2]
maximum carrier diameter stated on insert-carrier page—up to 33 in diameter[2]
maximum carrier diameter stated on lapping-carrier page—up to 48 in diameter[3]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org