Waferpedia

Comparison ledger

15 Lapperversus108T

Lapmaster 15 Lapper, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
108TPR Hoffman
OEMLapmasterPR Hoffman
CategoryCMPCMP
Wafer size—up to 12 in wafers
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15PR Hoffman 108T
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]—
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
carrier type listing—108T 9B - S/F / Lapmaster LSP-9 / etc.[2]
machine class—for double-sided planetary lapping & polishing machines[2]
wafer sizes stated on insert-carrier page—3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[2]
maximum carrier diameter stated on insert-carrier page—up to 33 in diameter[2]
maximum carrier diameter stated on lapping-carrier page—up to 48 in diameter[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org