Comparison ledger
Lapmaster 120 Continuous, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 120 ContinuousLapmaster | 108TPR Hoffman |
|---|---|---|
| OEM | Lapmaster | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | — | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 120 Continuous | PR Hoffman 108T |
| Specifications | ||
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[1] |
| machine class | — | for double-sided planetary lapping & polishing machines[1] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[1] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[1] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[2] |