Comparison ledger
KLA 0035235-003 MMD Head, KLA 2367, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2367KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Only one wafer size at a time |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA 2367 |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | Shinko LP[2] |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| SW Version | — | 10.4.507[2] |
| Wafer size | — | Only one wafer size at a time[2] |
| 300 mm (12") | — | Yaskawa + Asyst ISO Port or[2] |
| 200 mm (8") | — | Yaskawa + Asyst Versa Port (SMIF)[2] |
| GL | — | G Line[2] |
| IL | — | I Line[2] |
| VIS | — | Visible[2] |
| Equipment type | — | UV/visible brightfield inspector[3] |
| Inspection focus | — | sensitivity to a broad range of yield-relevant defect types[3] |
| Design node | — | 65nm and above[3] |
| Wafer sizes | — | 8 inch, 12 inch[2] |
| Wafer handling | — | only one wafer size at a time[2] |
| Software version | — | 10.4.507[2] |
| Lighting modes | — | GL: G Line; IL: I Line; VIS: Visible[2] |
| Inspection thresholds | — | 0.12 UV/GL/IL; 0.16 UV/GL/IL; 0.20 UV/GL/IL; 0.25 VIS; 0.39 VIS; 0.62 VIS[2] |
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