Comparison ledger
Hitachi 1305 BSG 3, Ontrak DSS 200 Series II Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | DSS 200 Series II WaferOntrak |
|---|---|---|
| OEM | Hitachi | Ontrak |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2023 Introduced |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | Ontrak DSS 200 |
| Specifications | ||
| Configuration | — | Post CMP[1] |
| Make | — | Ontrak[1] |
| Model | — | DSS 200 Series II Wafer[1] |
| Equipment type | — | Wafer Scrubber[1] |
| Wafer sizes | — | 6 inch[1] |
| Tool description | — | post-CMP semiconductor process tool[2] |
| Application | — | cleaning wafers after chemical mechanical polishing[2] |
| Wafer size | — | 8 inch[2] |
| Tool type | — | Wafer Scrubber[1] |
| Process use | — | Post CMP[1] |
| Introduced | — | 2023[2] |
| Power | — | 200 / 208 / 220 VAC[2] |
| Frequency | — | 50/60 Hz[2] |
| Breaker | — | 25 A (5.2 kW)[2] |
| Total FLA | — | 6.8 A (1.4 kW)[2] |
| CDA inlet pressure | — | 80-100 PSI[2] |
| DI water inlet pressure | — | 60-80 PSI[2] |
| Process solutions / chems inlet pressure | — | 15 PSI[2] |
| Noise level during process | — | 70 dB[2] |
Plan your fab
Building a Wet Processing / Clean process? Get a complete equipment list.
Open the fab equipment planner →