Comparison ledger
EV Group EVG 40 NT, Nikon 1505 G 6 E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EVG 40 NTEV Group | 1505 G 6 ENikon |
|---|---|---|
| OEM | EV Group | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 1988– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Nikon 1505 |
| Specifications | ||
| Manufacturer | EV Group[1] | — |
| Model | EVG 40 NT[1] | 1505 G 6 E[3] |
| Product type | Aligner[1] | — |
| Vintage | 2011[1] | — |
| Measurement scope | Lithography-relevant parameters and bond alignment accuracy[2] | — |
| Measurement methods | Critical dimension measurement, die-to-die alignment verification, multi-layer thickness measurement[2] | — |
| Tool format | Stand-alone tool[2] | — |
| Integrated module | AVM (HVM-integrated module)[2] | — |
| Application examples | Nanoimprint lithography and wafer-to-wafer bonding[2] | — |
| Verification capability | 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system[2] | — |
| Configuration | — | 5" reticle[3] |
| Resolution | — | 650 nm[4] |
| Numerical Aperture | — | 0.54[4] |
| Reduction | — | 5x[4] |
| Exposure Field | — | 15 x 15 mm[4] |
| Alignment Accuracy | — | 130 nm[4] |
| Wafer Size | — | 4 inch[3] |
| Light Source | — | g-line[5] |
| Introduction Year | — | 1988[4] |
| NA (Numerical Aperture) | — | 0.54[4] |
| Make | — | Nikon[3] |
| Category | — | Stepper[3] |
| Wafer Sizes | — | 4 inch[3] |
| Exposure type | — | g-line[4] |
| NA | — | 0.54[4] |
| Exposure field | — | 9.3 x 18.8 mm[4] |
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