Waferpedia

Comparison ledger

101versus200

EV Group 101, OAI 200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
200OAI
OEMEV GroupOAI
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101OAI 200
Specifications
OEMEV Group[1]OAI[4]
Model101[1]200[4]
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]Bay B[5]
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Tool owner—Brian Baker[4]
Serial number—1213[4]
Substrate size accommodation—up to 6"x6"[6]
Mask size accommodation—2"x2" to 7"x7"[6]
Maximum mask size (datasheet)—up to 9"x9"[7]
Alignment precision—1 micron[8]
Vacuum Chuck X, Y travel—±0.47" (12mm)[6]
Vacuum Chuck Z travel—±0.12" (3mm)[6]
Vacuum Chuck rotation—±7°[6]
Substrate Stage X, Y travel (datasheet)—±10mm[7]
Z travel (datasheet)—1500 microns[7]
Rotation (datasheet)—±3.5°[7]
Lamp power range—200W to 2000W[8]
UV wavelength range—Near or Deep UV (220nm to 436nm)[6]
Exposure intensity control—±2% of desired intensity[8]
Timer range—0-1000 seconds in 1 second intervals[6]
Dimensions (width)—31 inches[6]
Dimensions (height)—37 inches (datasheet: 37")[7]
Weight—250 lbs[7]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (8)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]nanofab.utah.edunanofab.utah.edu
  5. [5]nanofab.utah.edunanofab.utah.edu
  6. [6]manualslib.commanualslib.com
  7. [7]oainet.comoainet.com
  8. [8]oainet.comoainet.com