Waferpedia

Comparison ledger

DTG 8460 Taikoversus15

Disco DTG 8460 Taiko, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DTG 8460Lapmaster 15
Cited variants
  • DTG 8460 Wafer Backside[1]
—
Specifications
Configuration3 Chucks[2]—
Phase200-2008 V, 50 A, 50/60 Hz, 3 Phase[2]—
Voltage208 V[3]—
Wafer size12 inch[2]—
Process typeCassette to Cassette[2]—
Number of chucks3[2]—
Current50 A[2]—
Frequency50/60 Hz[2]—
Add-on chillerDTU 1531[2]—
AccessoriesUSV, Duct Unit, Vacuum Unit[2]—
Vintage year2012[4]—
Input Power—110 Vac[5]
Plate Diameter—15 inches (381 mm)[6]
Number of Conditioning Rings—3[6]
Ring ID—5.5 inches (140 mm)[6]
Standard RPM—60[6]
RPM Range (Variable Speed Drive)—0-60[6]
Drive Motor - Lapper—0.5 HP (0.37 kW)[6]
Drive Motor - Polisher—0.75 HP (0.56 kW)[6]
Length—25 inches (635 mm)[6]
Width—20 inches (508 mm)[6]
Height—24 inches (610 mm)[6]
Estimated Shipping Weight—285 lbs (129.3 kg)[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]tarasemi.comtarasemi.com
  5. [5]inventory listing
  6. [6]web.archive.orgweb.archive.org