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Comparison ledger

DFP 8160 Fully Automatedversus100R16

Disco DFP 8160 Fully Automated, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100R16Strasbaugh
OEMDiscoStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFP 8160 Fully AutomatedStrasbaugh 100R16
Specifications
ManufacturerDisco[1]—
ModelDFP 8160[1]—
Tool typeFully automated polisher[1]—
CategoryCMP[2]—
Wafer size8-inch to 12-inch wafers[3]—
type—1 spindle grinder/polisher[4]
drive system—DC drive system with 2 motors[4]
spindle RPM—1-180 RPM[4]
eccentric RPM—1-90 RPM[4]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[4]
capacity—16 inches[4]
spindle size—1-8 TPI[4]
overall dimensions—28 inches x 36 inches x 48 inches[4]
weight—500 lbs[4]
origin—made in the USA[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]excelltechnology.comexcelltechnology.com