Comparison ledger
Disco DFG 841 Grinder Lapper, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | Robot Unit– automated wafer handling between cassettes and chuck tables. | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG 841 | Lapmaster 12 Benchtop Lapping Polishing |
| Specifications | ||
| Spindle Speed (Max) | 7,000 rpm[1] | — |
| Power | AC 200V, 50/60 Hz, 3-Phase, 17 kVA[1] | — |
| Air Requirement | 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)[1] | — |
| Cutting Water | 0.2 MPa (2 kgf/cm²), 15 L/min[1] | — |
| Cooling Water | 0.2 MPa (2 kgf/cm²), 11 L/min[1] | — |
| Grinding Method | In-feed grinding with wafer rotation[1] | — |
| Accuracy | Planarity ≤ 1.5 µm across wafer[1] | — |
| Configuration | Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).[1] | Ring lapper[5] |
| Wafer size | Robot Unit– automated wafer handling between cassettes and chuck tables.[1] | — |
| Spindle options | Configurable for coarse + fine grind[1] | — |
| Make | Disco[1] | Lapmaster[2] |
| Model | DFG 841[1] | 12[2] |
| Tool type | Grinder / Lapper / Polisher[1] | — |
| Planarity accuracy | ≤ 1.5 µm across wafer[1] | — |
| Vacuum coolant unit | Provides cooling and chip removal; separate floor-standing unit[1] | — |
| Chiller unit | Stabilizes grinding fluid temperature[1] | — |
| Filter unit | For grinding water/coolant circulation[1] | — |
| Robot unit | Automated wafer handling between cassettes and chuck tables[1] | — |
| Transformer | 20 kVA, Tokyo Sanyo Denki; converts facility power (208–415 V input to 200 V output)[1] | — |
| Electrical compartment | Control and power distribution[1] | — |
| Chuck tables | Two chuck tables, porous vacuum type[1] | — |
| Cassette handling | Automatic cassette loading/unloading with same-cassette return[1] | — |
| Wafer thickness measurement | Contact gauge system[1] | — |
| Control/software | With HDD and Software[1] | — |
| Category | — | CMP[3] |
| Type/Application | — | Single sided[4] |
| Plate diameter | — | 12 in[4] |
| No. of conditioning rings | — | 3[5] |
| Base | — | Rigid, lightweight, cast aluminum base[5] |
| Standard RPM | — | 60 RPM[5] |
| RPM range with variable speed drive | — | 0-60[5] |
| Drive motor - lapper | — | 0.5 HP[5] |
| Drive motor - polisher | — | 0.75 HP[5] |
| Length | — | 25 in[5] |
| Width | — | 18 in[5] |
| Height | — | 24 in[5] |
| Estimated shipping weight | — | 240 lbs[5] |
| Approximate weight | — | 135 lbs / 61 kg[6] |
| Approximate dimensions | — | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[6] |
| Electrical system | — | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[6] |
| Motor | — | 1/3 hp / 0.25 kW motor with gear reducer[6] |
| Abrasive feed system | — | Designed for water or oil based lapping slurries[6] |
| Automatic cycle timer | — | Automatic digital cycle timer[6] |
| Ring configuration | — | Ring lapper[5] |
| Ring ID | — | 4.25 inches[5] |