Waferpedia

Comparison ledger

DFD 6341 Fully Automatic Dicingversus15

Disco DFD 6341 Fully Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFD 6341 Fully Automatic DicingLapmaster 15
Specifications
Max workpiece sizeΦ8 inch[1]—
X-axis Cutting range210 mm[1]—
Cutting speed0.1 to 1,000 mm/s[1]—
Y1・Y2-axis Cutting range210 mm[1]—
Index step0.0001 mm[1]—
Positioning accuracyWithin 0.002/210 (Single error), Within 0.002/5[1]—
Z-axis Max stroke19.22 mm (for Φ2 inch blade), 19.9 mm (for Φ3 inch blade)[1]—
Z-axis Moving resolution0.00005 mm[1]—
Z-axis Repeatability accuracy0.001 mm[1]—
θ-axis Max rotating angle380 deg[1]—
Spindle rated torque0.19 N·m (1.2 kW/High speed rotation), 0.29 N·m (1.8 kW), 0.7 N·m (2.2 kW?)[1]—
Spindle rotation speed range6,000 – 60,000 min⁻¹ (1.2 kW/1.8 kW), 20,000 – 80,000 min⁻¹ (High speed rotation), 3,000 – 30,000 min⁻¹ (2.2 kW?)[1]—
Equipment dimensions (W×D×H)1,180 × 1,080 × 1,820 mm[1]—
Equipment weightApprox. 1,500 kg[1]—
Optional high-speed flash alignment speed600 mm/s[1]—
Input Power—110 Vac[2]
Plate Diameter—15 inches (381 mm)[3]
Number of Conditioning Rings—3[3]
Ring ID—5.5 inches (140 mm)[3]
Standard RPM—60[3]
RPM Range (Variable Speed Drive)—0-60[3]
Drive Motor - Lapper—0.5 HP (0.37 kW)[3]
Drive Motor - Polisher—0.75 HP (0.56 kW)[3]
Length—25 inches (635 mm)[3]
Width—20 inches (508 mm)[3]
Height—24 inches (610 mm)[3]
Estimated Shipping Weight—285 lbs (129.3 kg)[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]disco.com.sgdisco.com.sg
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org