Waferpedia

Comparison ledger

DAD 341 Automatic Dicingversus15

Disco DAD 341 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1998 Vintage year—
Control system——
Generation——
FamilyDisco DADLapmaster 15
Specifications
Spindle Max Revolution60..000 RPM[1]—
PowerAC 200 V[1]—
Phase3 Phase[1]—
Configuration250 Nl/min.[1]—
Power AC200 V[1]—
Power Rating3.0 KVA[1]—
AIR Pressure5 KGF/CM2 (0.5 MPa)[1]—
AIR Flow250 Nl/min[1]—
N2 Pressure5 Lgf/cm2 (0.5 MPa)[1]—
Cutting Water Pressure3 KGF/CM2 (0.3 MPa)[1]—
Cutting Water Flow4.0 L/min[1]—
Cooling Water Pressure2 kgs/cm2 (0.2 MPa)[1]—
Cooling Water Flow1.5 L/min[1]—
Vintage1998[1]—
Input Power—110 Vac[2]
Plate Diameter—15 inches (381 mm)[3]
Number of Conditioning Rings—3[3]
Ring ID—5.5 inches (140 mm)[3]
Standard RPM—60[3]
RPM Range (Variable Speed Drive)—0-60[3]
Drive Motor - Lapper—0.5 HP (0.37 kW)[3]
Drive Motor - Polisher—0.75 HP (0.56 kW)[3]
Length—25 inches (635 mm)[3]
Width—20 inches (508 mm)[3]
Height—24 inches (610 mm)[3]
Estimated Shipping Weight—285 lbs (129.3 kg)[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org