Waferpedia

Comparison ledger

3220versusDW 288 Wire Cutting

Disco 3220, Meyer Burger DW 288 Wire Cutting, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220—
Cited variants—
Specifications
equipment typedicing saw[3]—
Workplace sizeø150 mm[4]—
Spindle layoutSingle[4]—
Spindle output1.5 kW at 30,000 min-1[4]—
Spindle max revolution speed40,000 min-1[4]—
X-axis feed speed range0.1 – 500 mm/s[4]—
Y-axis index step0.0001 mm[4]—
Z-axis repeating accuracy0.001 mm[4]—
Z-axis max blade sizeø58 mm[4]—
Web length—420 mm[2]
Wire speed—25 m/s (1500 m/min)[2]
Wire acceleration—8 m/s² (< 4 s)[2]
Min. wire diameter—100 μm[2]
Max. wire tension—45 N[2]
Rocking principle—Rocking of work piece[2]
Rocking angle—±12°[2]
Wire guide roller axis distance—540 mm[2]
Cutting fluid tank—240 l[2]
Machine dimensions (L × W × H)—3620 × 1780 × 3010 mm[2]
Machine weight—10500 kg[2]
Max. work piece size—Ø 8″ × 420 mm or □ 210 × 420 mm[2]
Max. work piece dimensions (round)—Ø 206 × 420 mm[2]
Max. work piece dimensions (square)—210 × 420 mm[2]
Cutting fluid tank capacity—240 l[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]precision-surface.comprecision-surface.com
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]semistarcorp.comsemistarcorp.com