Comparison ledger
Disco 321, Takatori MWS-44SN, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | MWS-44SNTakatori |
|---|---|---|
| OEM | Disco | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Takatori MWS-44SN |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | Multi Wire Saw[4] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Product line | — | MWS[4] |
| Process category | — | Slicing and grinding[4] |
| Machine type | — | Multi wire saw[4] |
| Rocking motion-slicing mechanism | — | Allows easier abrasive outlet and smoothness of cutting surface to simplify subsequent processes[5] |
| Slurry supply | — | Effective lapping with slurry supplied from the nearest nozzle to the works for uniform and precise cutting[5] |
| Wire control | — | Direct drive system[5] |
| Wire control benefit | — | Saves space and allows speedy cutting[5] |
| Wire tension control | — | Electric control with stable wire tension[5] |
| Control method | — | Microcomputer-controlled cutting conditions for various work pieces[5] |
| Cutting recipes | — | 60 cutting recipes settable[5] |
| Wire winding | — | Automatic wire winding[5] |
| Slurry compatibility | — | Diamond slurry compatible[5] |
| Listed materials | — | Sapphire, SiC, GaN, Quartz Crystal, Ceramic[6] |
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