Comparison ledger
Disco 321, Disco DFL 7361, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DFL 7361Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| OEM | Disco[3] | Disco[1] |
| Model | 321[3] | DFL 7361[1] |
| Equipment type | Wafer Dicing Saw[3] | — |
| Facility context | Cleanroom Instrumentation[3] | — |
| Application area | Nano and Micro Fabrication[3] | — |
| Location | FNT 4.106[3] | — |
| Wafer Size | Up to 6 inches[4] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[5] | — |
| Spindle Power (alternate) | 1500 Watt spindle[4] | — |
| Non-Contact Setup | Non Contact Setup[5] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[5] | — |
| Broken Blade Detection | Broken Blade Detection[5] | — |
| Light Tower | Includes Light Tower[5] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[4] | — |
| Wafer size capability | Up to 6" wafers[5] | — |
| Chuck | 6-inch porous film frame chuck[4] | — |
| Spindle power | 1500-watt spindle[4] | — |
| Footprint | Small footprint[4] | — |
| Setup | Non-contact setup[5] | — |
| Blade break detection | Broken blade detection[5] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[5] | — |
| Configuration | — | Type FX Laser Head[1] |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle[1] |
| Max workpiece size | — | ø300 mm[2] |
| Processing mode | — | Fully automatic[2] |
| X-axis feed speed range | — | 0.1 - 1,000 mm/s[2] |
| Y-axis positioning accuracy | — | 0.003 mm within 310 mm[2] |
| Dimensions (W x D x H) | — | 1,210 x 3,270 x 1,906 mm[2] |
| Weight | — | approx 2,570 kg[2] |
| Supported wafer size | — | 2" to 12"[1] |
| Laser head | — | Type FX[1] |
| Optics system | — | BSS-6[1] |
| Wafer cleaning system | — | Integrated with Atomizing Nozzle[1] |
| Category | — | Laser Saw[1] |
| Maximum workpiece size | — | ø300 mm[2] |
| Processing method | — | Fully automatic[2] |
| Dimensions (WxDxH) | — | 1,210 x 3,270 x 1,906 mm[2] |
| Chuck table | — | Chuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1] |
| User interface | — | Graphical User Interface with Touch Screen[1] |
| Vision system | — | High Resolution Image Processing System with Auto Focus[1] |
| Frame handling | — | Fully Automatic Frame Handling System[1] |
| Coating system | — | Independent Hogomax spin coating system[1] |
| Loading/unloading | — | Cassette Loading / Unloading[1] |
| Duct unit | — | Duct Unit (Internal Type)[1] |
| Power conditioning | — | Overseas Transformer Unit; Uninterruptible Power Supply[1] |
| Documentation | — | Operation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1] |
| Ablation processing support | — | Supports ablation processing; corresponding to 300mm workpiece[2] |
| Laser Head Type | — | Type FX[1] |
| Chuck Table Movement | — | X and Y direction[1] |
| Image Processing | — | High Resolution Image Processing System with Auto Focus[1] |
| Spin Coating System | — | Independent Hogomax spin coating system[1] |
| Chuck Table Sizes | — | 12" and 8" Porous Chuck Table & Spinner Table[1] |
| Cassette Handling | — | Cassette Loading / Unloading[1] |
| Duct Unit | — | Internal Type[1] |
| Transformer | — | Overseas Transformer Unit[1] |
| Power Supply | — | Uninterruptible Power Supply[1] |
| X-Axis Feed Speed | — | 0.1 - 1,000 mm/s[2] |
| Y-Axis Positioning Accuracy | — | 0.003 mm or less per 310 mm[2] |
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