Comparison ledger
Denton Vacuum Discovery, Denton Vacuum Discovery 18, Denton Vacuum Discovery Cathode, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DiscoveryDenton Vacuum | Discovery 18Denton Vacuum | Discovery CathodeDenton Vacuum |
|---|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition | Deposition |
| Wafer size | — | 6-inch diameter stage | — |
| Process node | — | — | — |
| Introduced | — | — | — |
| Production run | — | — | — |
| Lifecycle | — | — | — |
| Lifecycle milestones | — | — | — |
| Control system | — | — | — |
| Generation | — | — | — |
| Family | Denton Vacuum Discovery | Denton Vacuum Discovery | Denton Vacuum Discovery |
| Cited variants | — | — | |
| Specifications | |||
| Configuration | With Lipon Deposition[3] | — | 12.0" sputtering system with planetary Load lock and robot loading assemblies[7] |
| Technology | Magnetron sputtering[4] | — | — |
| Substrate Size (Discovery 200) | Up to 200 mm[1] | — | — |
| Substrate Size (Discovery 300) | Up to 300 mm[1] | — | — |
| Cathode Configuration (Discovery 200) | Up to four 4" diameter confocal sources[1] | — | — |
| Cathode Configuration (Discovery 300) | Up to three 6" diameter confocal sources[1] | — | — |
| Power Supply | DC, RF, Pulsed DC[1] | — | — |
| Vacuum | Cryo/Turbo[1] | — | — |
| Substrate Bias | RF bias with dedicated power supply and auto matching network[1] | — | — |
| Plasma Emission Monitor | Yes (Discovery 200/300), No (Discovery V), Yes (Discovery I)[1] | — | — |
| Coating Uniformity (Discovery 200/300) | < +/-5%[1] | — | — |
| Coating Uniformity (Discovery V) | < +/-2%[1] | — | — |
| Coating Uniformity (Discovery I) | < +/-0.25%[1] | — | — |
| Deposition type | — | Sputter deposition of metals, alloys, and insulating thin films[5] | — |
| Film thickness range | — | From a few nm to hundreds of nm[5] | — |
| Cathodes | — | Three 3-inch diameter confocal cathodes[5] | (4) 12" Cathodes[7] |
| RF power supplies | — | 2 RF power supplies[5] | — |
| DC power supply | — | Switchable DC power supply[5] | — |
| Co-sputter capability | — | Yes[5] | — |
| Reactive sputtering | — | Available with nitrogen or oxygen[5] | — |
| Stage diameter | — | 6-inch diameter stage[5] | — |
| Substrate rotation uniformity | — | +/- 10%[5] | — |
| Pump system | — | Cryo and turbo pumped[5] | — |
| Base pressure | — | 1 x 10^7 Torr[5] | — |
| Substrate heating | — | Up to 200 C[5] | — |
| Liftoff deposition | — | Available with sputter power[5] | — |
| Argon pressure range | — | 3-15 mT controllable with 200 sccm MFC controller[5] | — |
| Number of cathodes | — | 3[5] | — |
| Cathode diameter | — | 3 inches[5] | — |
| Co-sputtering capability | — | Yes[5] | — |
| Substrate rotation | — | Yes[5] | — |
| Uniformity | — | +/- 10%[5] | — |
| Pumping system | — | Cryo and turbo pumped[5] | — |
| MFC controller | — | 200 sccm (no APC valve)[5] | — |
| Deposition technique | — | Sputter deposition of metals, alloys, and insulating thin films (user configurable)[5] | — |
| Film thickness control | — | Controllable from a few nm to hundreds of nm[5] | — |
| Power supplies | — | 2 RF power supplies; switchable DC power supply[5] | — |
| Substrate stage size | — | 6-inch diameter stage[5] | — |
| Chamber material | — | 304L SS, 18" Diameter x 13.5" Deep[6] | — |
| Baseplate material | — | 304L SS, 20" Diameter[6] | — |
| High vacuum pump | — | 140 l/s Turbomolecular Pump[6] | CTI Cryogenics High Vacuum Pump/Blanket Heater[7] |
| Mechanical pump | — | 11 cfm[6] | — |
| Control cabinet | — | Single 19" Standard EIA Rack, with Single Point Power Connection[6] | — |
| High vacuum gauge | — | Digital Cold Cathode Auto-Ranging[6] | — |
| Control type | — | PLC Control of Auto Pump Sequence[6] | — |
| Feedthroughs | — | Baseplate (15) 1.0", (2) 2.75" Conflats, (2) 1.33" Conflats[6] | — |
| Floor space | — | 96" Wide x 48" Deep[6] | — |
| Chamber viewpoints | — | (1) 4.0" Diameter High Vacuum Valve Horizontal, 5.75" Diameter Bellows Sealed[6] | — |
| Sputtering system size | — | — | 12.0 inch[7] |
| Chamber dimensions | — | — | Approx. 4' X 6' X 12" Stainless Steel Chamber[7] |
| Ion source | — | — | Veeco 5 cm Gridded Ion Source with Gas Controls[8] |
| Cryopump | — | — | Torr400 Cryopump with Oxford E500 Dual Temperature Monitor[7] |
| Turbo molecular pump | — | — | KYKY F400 Turbo Molecular Pump with FV-LII Pump Controller[7] |
| Compressor | — | — | CTI-Cryogenics 9600 Compressor[7] |
| DC power supplies | — | — | (4) Advance Energy Pinnacle plus DC Power Supplies[8] |
| Robot | — | — | Loader/Unloader with Epson G6-453c Robot, Vintage 9/10[7] |
| Controller | — | — | Ion Tech Mps-3000 fc Controller[7] |
| Load lock | — | — | Load Lock Loader with PLC Controller[7] |
| Gate valve | — | — | Vat Gate Valve[7] |
| Adaptive pressure controller | — | — | Vat Adaptive Pressure Controller[7] |
| Pressure monitors | — | — | Assorted Pressure Monitors[7] |
| Isolation valves | — | — | Isolation Valves[7] |
| Power supply/control | — | — | Stand Alone Power Supply/Control[7] |
| Computer system | — | — | Computer System with Related Hardware/Software[7] |
| Manufacturer | — | — | Denton Vacuum[7] |
| Model | — | — | Discovery Cathode[7] |
| Category | — | — | Deposition[8] |
| Process type | — | — | Sputtering system[8] |
| Wafer size | — | — | 12.0-inch[8] |
| Wafer handling | — | — | Planetary load lock and robot loading assemblies[8] |
| Chamber | — | — | Approx. 4' x 6' x 12" stainless steel chamber[7] |
| Vacuum pumps | — | — | CTI Cryogenics high vacuum pump/blanket heater; Torr400 cryopump with Oxford E500 dual temperature monitor; KYKY F400 turbo molecular pump with FV-LII pump controller[7] |
| Pressure control | — | — | Vat gate valve and Vat adaptive pressure controller[7] |
| Control system | — | — | Ion Tech Mps-3000 fc controller; stand alone power supply/control; computer system with related hardware/software[7] |
| Robot loader/unloader | — | — | Epson G6-453c robot[7] |
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