Comparison ledger
CEE 300 Bake Plate, YES PBV-300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PBV-300YES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 300 Bake Plate | YES PBV-300 |
| Cited variants | — | |
| Specifications | ||
| Wafer size | up to 300mm wafer[2] | 300mm and 200mm[5] |
| Software | Internal OS[2] | — |
| Voltage | 208V[2] | — |
| Max Substrate Size | 300mm round or 12" x 12" square[1] | — |
| Min Substrate Size | 4 inch round[1] | — |
| Max Temperature | 300°C (400°C optional)[1] | — |
| Temperature Resolution | 0.1°C[1] | — |
| Temperature Uniformity | ±0.3% across working area[1] | — |
| Smart Pin Height Range | 0-19 mm[1] | — |
| Weight (machine only) | 146 lb (66.2 kg)[3] | — |
| Dimensions | 18" H x 18.75" W x 26.25" D[3] | — |
| Power | 3100-4100 watts[3] | — |
| Exhaust Port | 2" (50.8mm) OD[3] | — |
| Automation | — | Automated[4] |
| Process family | — | Polyimide/BCB Vacuum Cure Ovens[4] |
| Associated process applications | — | polyimide, BCB, low-k dielectrics and copper anneal[4] |
| Manufacturer | — | YES[6] |
| Category | — | Thermal / Diffusion[6] |
| Processing range | — | 300mm and 200mm[5] |
| System type | — | Fully automated 300mm and 200mm polyimide/BCB/copper anneal/vacuum bake system[5] |
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