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Comparison ledger

100versusNSR-1505G4

CEE 100, Nikon NSR-1505G4, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEENikon
CategoryLithographyLithography
Wafer size6"4"
Process node—better than 750 nm resolution; better than 150 nm alignment
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—g-line
FamilyCEE 100Nikon NSR-1505G4
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]4" wafers[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Type—Wafer stepper[3]
Reduction—5x reduction[3]
Reticle size—5" reticle[3]
Exposure source—g-line UV[3]
Resolution—better than 750 nm[3]
Alignment—better than 150 nm[3]
Reduction factor—5x[3]
Alignment accuracy—better than 150 nm[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.ece.cmu.edunanofab.ece.cmu.edu