Comparison ledger
Cascade Microtech Summit 11000, Signatone 1070, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Summit 11000Cascade Microtech | 1070Signatone |
|---|---|---|
| OEM | Cascade Microtech | Signatone |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Cascade Microtech Summit 11000 | Signatone 1070 |
| Specifications | ||
| Z-lift range | 5.5 mm linear lift with <2 µm repeatability[1] | — |
| X-Y stage travel | 203 mm × 203 mm[1] | — |
| X-Y resolution | 0.2″ per turn[1] | — |
| Wafer Size | 8 inch (200mm)[1] | — |
| X-Y Stage Resolution | 0.2 inch per turn[1] | — |
| Z-lift Range | 5.5 mm linear lift[1] | — |
| Z-lift Repeatability | < 2 μm[1] | — |
| Maximum Frequency (RF) | 110 GHz[2] | — |
| Wafer Chuck | 6-inch/150mm RF/Microwave chuck (Ni)[3] | — |
| X-Y Stage Resolution (alternative) | 0.1 μm resolution[3] | — |
| Z Travel | 5mm with 1 μm resolution[3] | — |
| Bridge Travel (X) | 6-inch X axis travel (+/- 3-inch from center of travel)[3] | — |
| Bridge Travel (Y) | 8-inch Y axis travel (+/- 4-inch from center of travel)[3] | — |
| Bridge Z-lift | 3-inch linear manual Z-lift[3] | — |
| Supported wafer size | 8 inch (200 mm)[1] | — |
| X-Y stage resolution (manual) | 0.2″ per turn[1] | — |
| X-Y travel resolution | 0.1 µm[3] | — |
| Large area bridge X travel | 6 inch[3] | — |
| Large area bridge Y travel | 8 inch[3] | — |
| Large area bridge Z-lift | 3 inch linear manual[3] | — |
| Maximum on-wafer RF frequency | 110 GHz[2] | — |
| Make | — | Signatone[4] |
| Model | — | 1070[4] |
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