Waferpedia

Comparison ledger

017-0146-01 Prealignerversus6000

Brooks 017-0146-01 Prealigner, OAI 6000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6000OAI
OEMBrooksOAI
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0146-01 PrealignerOAI 6000
Specifications
Product name—Model C&D P9000 / OAI 6000: Integrated Lithography Cell[1]
System type—Integrated lithography cell[1]
Process steps—Coat | Bake | Align/Expose | Develop[1]
Manufacture—Fully manufactured in the USA[1]
Configuration—Cluster configuration[1]
Wafer flow—Allows for dynamic wafer flow and parallel application processing[1]
Control interface—Single terminal for control over recipe and program selection; P9000 performs as the master user interface[1]
Operator requirement—Fewer operators needed in the lithography module[1]
Wafer handling—Reduced wafer handling[1]
Footprint—Small footprint[1]
Wafer size capability—Multiple wafer sizes can be processed simultaneously[1]
Product class—Automated Front & Backside Mask Aligner[2]
Application area—For production semiconductors, MEMS, sensors, advanced packaging, IOT, microfluidics[2]
Type—Automated Front & Backside Mask Aligner System / Integrated Lithography Cell[2]
Capabilities—Coat, Bake, Align/Expose, Develop[1]
Country of Manufacture—USA[1]
Wafer Size Support—Multiple wafer sizes can be processed simultaneously[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org