Waferpedia

Comparison ledger

017-0146-01 Prealignerversus101

Brooks 017-0146-01 Prealigner, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMBrooksEV Group
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0146-01 PrealignerEV Group 101
Specifications
OEM—EV Group[1]
Model—101[1]
Equipment name—EVG 101 Spray Coater[1]
NEMO ID—evgspraycoat[1]
Training required—EVG 101 Training[1]
Training duration—1.50 hours[1]
Processing technique—Resist Spray Coat (manual)[1]
Cleanliness—"All"[1]
Location—SNF Paul G Allen L107 Cleanroom[1]
Wafer diameter (substrate size)—up to 300 mm[2]
Available modules—Spin coat / OmniSpray® / develop[2]
Wafer handling options—Bowed / warped / thin wafer handling, edge handling[2]
Dispense options—Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]
Processing technique (at SNF)—Resist Spray Coat (manual)[3]
Cleanliness group (at SNF)—"All"[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu