Waferpedia

Comparison ledger

101-149-053 Gold Boosterversus747677E

Branson 101-149-053 Gold Booster, West Bond 747677E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
747677EWest Bond
OEMBransonWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterWest Bond 747677E
Specifications
Configuration1:1.5[1]—
ManufacturerBranson[2]—
Model101-149-053[2]747677E[4]
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
OEM—West Bond[4]
Location—Sample Prep Room[4]
Primary training contact—Talmage Tyler[4]
Bond force range—10-250 grams[4]
Ultrasonics—built-in, 4 watts[4]
Wire size—1 mil (25.4 um)[4]
Ball bond size—~ 85 um[4]
Equipment type—Wire bonder[5]
Primary bonding material—Gold wire[4]
Bonding configuration—Ball bonding[4]
Convertible bonding methods—Wedge and ball bonding[6]
Compatible wire materials—Al and Au wires[6]
Compatible wire diameter range—0.7 mil to 2 mil[6]
Ultrasonic transducer—4 W, 63 kHz[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]smif.pratt.duke.edusmif.pratt.duke.edu
  5. [5]smif.pratt.duke.edusmif.pratt.duke.edu
  6. [6]uwaterloo.cauwaterloo.ca