Comparison ledger
Blanchard 18 D Surface, Disco DAD3221, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | DAD3221Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DAD3221 |
| Specifications | ||
| Voltage | 416 V[1] | — |
| Phase | 3 Phase[1] | — |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[1] | — |
| Model | 18 D[1] | — |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[1] | — |
| Type | — | automatic dicing saw[3] |
| Wafer size | — | 100, 150 mm wafers[3] |
| Setup | — | non-contact setup[3] |
| Blade monitoring | — | blade breakage detector[3] |
| Cutting functions | — | circle cut for edge trimming or down sizing[3] |
| Particle/ESD mitigation | — | CO2 injector to prevent particle adhesion and electrostatic discharge damage[3] |
| Alignment aids | — | pattern recognition system; automatic micro-alignment[3] |
| Equipment type | — | Automatic dicing saw[3] |
| Wafer / substrate size | — | 100, 150 mm wafers[3] |
| Substrate size | — | up to 150mm diameter[4] |
| Max. workpiece size | — | Φ6 inch (150 mm × 150mm user-specified specification)[5] |
| Non-contact setup | — | Yes[3] |
| Blade breakage detector | — | Yes[3] |
| Circle cut | — | For edge trimming or downsizing[3] |
| CO2 injector | — | Prevents particle adhesion and electrostatic discharge damage[3] |
| Pattern recognition system | — | Yes[3] |
| Automatic micro-alignment | — | Yes[3] |
| Spindle layout | — | Single[5] |
| Standard rated output | — | 2.0 kW at 40,000 min-1[5] |
| Optional rated output | — | 1.8 kW at 60,000 min-1[5] |
| Equipment dimensions | — | 490 × 870 × 1,670 mm[5] |
| Equipment weight | — | Approx. 420 kg[5] |
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