Waferpedia

Comparison ledger

200 ACUversusTE 8500

Axcelis 200 ACU, Tokyo Electron TE 8500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
TE 8500Tokyo Electron
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron TE 8500
Cited variants—
  • TE 8500 P Dry[1]
  • TE 8500 PESC Dry[1]
Specifications
ConfigurationParts Machine[2]—
ManufacturerAxcelis[2]—
Model200 ACU[2]—
Tool typeAsher[2]—
Wafer size200mm[4]6 inch[1]
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
Process type—Etch (Dry)[7]
Chambers (PESC Dry)—1[1]
Application (PESC Dry)—Oxide etch with endpoint capability[1]
Vintage—1994[7]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]Equipment inventory listing
  7. [7]layla-ec.comlayla-ec.com