Waferpedia

Comparison ledger

200 ACUversus6500 HRe-

Axcelis 200 ACU, Tegal 6500 HRe-, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tegal 6500 HRe-
Cited variants—
Specifications
ConfigurationParts Machine[2]—
ManufacturerAxcelis[2]—
Model200 ACU[2]—
Tool typeAsher[2]—
Wafer size200mm[4]—
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
System type—Dual Frequency Etch System Series[1]
Tool architecture—Hosts a cluster of plasma etching tools[1]
Etch chamber configuration—One or two etching chambers[1]
Wafer processing modes—Serial or parallel wafer processing[1]
Loading ports—Single or dual loading ports[1]
Plasma generation—Dual frequencies for high-density, capacitively coupled plasma (CCP) generation[1]
Plasma confinement—Magnetic plasma confinement[1]
Etch precision—Down to the sub-micron level[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]plasmatherm.complasmatherm.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com