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Comparison ledger

200 ACUversusExelan Dry

Axcelis 200 ACU, Lam Research Exelan Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Exelan DryLam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research Exelan Dry
Cited variants—
Specifications
ConfigurationParts Machine[4]—
ManufacturerAxcelis[4]Lam Research[8]
Model200 ACU[4]Exelan Dry[8]
Tool typeAsher[4]dry etch chamber[9]
Wafer size200mm[6]—
Serial numberAU6A356AH[6]—
Computer systemM 200 PC, M 200[7]—
Part numberSC 4572 A[7]—
Volts208[7]—
Amps30[7]—
Equipment typeAsher[4]—
Wafer configuration8 inch[5]—
Wafer Size—300mm[1]
Vintage (manufacturing year)—2005[1]
Wafer Size (via version)—200mm[3]
Vintage—2004-06-01[2]
Vintage year—2005[9]
Variant designation—V2 Exelan[9]
Variant wafer size—200mm[9]
Variant vintage year—2004[9]

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Sources (9)Every fact above is drawn from these public sources
  1. [1]csisemi.comcsisemi.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]inventory listing
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]wotol.comwotol.com
  7. [7]semistarcorp.comsemistarcorp.com
  8. [8]Equipment inventory listing
  9. [9]waferpedia.comwaferpedia.com