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Comparison ledger

XT 1400 D ArFversus100

ASML XT 1400 D ArF, CEE 100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMASMLCEE
CategoryLithographyLithography
Wafer sizeWafer Stage6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML XT 1400 D ArFCEE 100
Cited variants—
Specifications
ConfigurationProcess Module:[2]—
Wafer sizeWafer Stage[2]Up to 6 inches[3]
Tool type—Spray Developer[1]
Accepts wafer size—up to 6" wafers[3]
Programmable programs—10 programs[3]
Steps per program—up to 10 steps[3]
Programmable step parameters—Acceleration, Speed, Time[3]
Associated document—CEE Model 100CB Spinner.doc[3]
Programs—10 programs each with up to 10 steps[3]
Control parameters—Acceleration, Speed, Time[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu