Waferpedia

Comparison ledger

Mirra Mesaversus72

Applied Materials Mirra Mesa, Lapmaster 72, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: CMP, null[1]
Side-by-side comparison of selected equipment models
Attribute
Mirra MesaApplied Materials
72Lapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra MesaLapmaster 72
Cited variants
  • Mirra Mesa CMP 5201[2]
  • Model 72 Open Face Flat Polishing Machine[3]
  • Model 72 Polisher[4]
  • 72" Lapmaster, Open-Face, (4) 27" ID Rings, 5-32 RPM, 25HP, Slurry System, 2001[1]
  • Open Face (OF)[5]
  • Pneumatic Lift (PL)[5]
  • Model 72 Open Face[5]
  • Model 72 Pneumatic Lift[3]
Specifications
CMP ModelMirra Mesa[6]—
ProcessOX[6]—
Polisher System Module4 Head 3 Platen[6]—
ConfigurationPlaten 1 configuration:[6]27" ID Rings[4]
Platen 1 TypeWith window, belt + gear CVT[6]—
Platen 1 endpointFull scan and motor torque[6]—
Platen 1 slurry armStandard tunable[6]—
Platen 1 pad conditioner armStandard[6]—
Platen 2 TypeWith window, belt + gear CVT[6]—
Platen 2 endpointFull scan[6]—
Platen 2 slurry armStandard tunable[6]—
Platen 2 pad conditioner armStandard[6]—
Platen 3 TypeWith window, belt + gear CVT[6]—
Platen 3 endpointFull scan[6]—
Platen 3 slurry armStandard tunable[6]—
Platen 3 pad conditioner armStandard[6]—
Polishing head3 zone[6]—
Slurry Delivery2 types of slurry[6]—
ModelMirra Mesa[6]72[4]
CategoryCMP (Chemical Mechanical Polisher)[6]—
Slurry flow rate controlPeristaltic pump[6]—
FABs port3 Port[6]—
Electrical requirements50/60 HZ; 200-230V; three-phase four-wire[6]—
Cleaner quantity1 unit[6]—
Cleaner robotworking beam Megasonics Module[6]—
Cleaning methodVertical[6]—
Megasonics delivery type2 Chem flow meter type[6]—
Brush 1 clean1 Chem and DIW[6]—
Brush 1 flow typeflow meter type[6]—
Brush 2 clean1 Chem and DIW[6]—
Brush 2 flow rateflow meter type[6]—
Dry typeSpin Dryer[6]—
DryingLamp heater Drying; N2 Drying[6]—
Line Frequency50/60 HZ[6]—
OEMApplied Materials[6]—
Facilities optionEMO Guard Ring[6]—
Line voltage200-230V[6]—
ConnectionThree-phase four-wire[6]—
Power lampGreen Lamp[6]—
Power connected lampPower Connected Lamp[6]—
GFI typeSTANDARD 30mA[6]—
Voltage—480 V[4]
Plate Diameter—72 inches (1829 mm)[5]
Number of Conditioning Rings—4[3]
Ring Inside Diameter—27.25 inches (692 mm)[5]
Standard RPM—30[5]
RPM Range (Variable Speed Drive)—5–32[5]
Drive Motor (Lapper)—20 HP / 15 kW[5]
Drive Motor (alternate listing)—25 HP[1]
Working Height—36 inches (914 mm)[5]
Dimensions (Open Face)—100 inches x 110 inches x 63 inches (2540 mm x 2794 mm x 1600 mm)[5]
Dimensions (Pneumatic Lift)—124 inches x 110 inches x 108 inches (3150 mm x 2794 mm x 2743 mm)[5]
Est. Shipping Weight (Open Face)—15,000 lbs (6804 kg)[5]
Est. Shipping Weight (Pneumatic Lift)—20,000 lbs (9072 kg)[5]
Ring Height—4.0 inches[1]
Plate Thickness—1-5/8 inches[1]
Machine type—Polisher[4]
Plate diameter—72 in[5]
Conditioning rings—4[3]
Ring ID—27.25 in[5]
Ring size—27" ID rings[4]
Speed range—5-32 RPM[4]
RPM range with variable speed drive—5-32[5]
Drive motor—25 HP[4]
Version—Open Face[3]
Overall dimensions, Open Face—100 in x 110 in x 63 in H[5]
Weight, Open Face—15,000 lbs[5]
Serial number—7200010[1]
Year stated in source—2001[1]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]libertymachinery.comlibertymachinery.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]lapmaster-wolters.co.uklapmaster-wolters.co.uk
  4. [4]Equipment inventory listing
  5. [5]web.archive.orgweb.archive.org
  6. [6]inventory listing