Waferpedia

Comparison ledger

Mirra MesaversusIPEC AvantGaard 776

Applied Materials Mirra Mesa, Lam Research IPEC AvantGaard 776, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: CMP, null[1]
Side-by-side comparison of selected equipment models
Attribute
Mirra MesaApplied Materials
OEMApplied MaterialsLam Research
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra MesaLam Research IPEC
Cited variants
  • Mirra Mesa CMP 5201[2]
  • IPEC AvantGaard 776 Tungsten[3]
  • IPEC AvantGaard 776 (Dielectric)[4]
Specifications
CMP ModelMirra Mesa[5]—
ProcessOX[5]Tungsten[3]
Polisher System Module4 Head 3 Platen[5]—
ConfigurationPlaten 1 configuration:[5]Dielectric[1]
Platen 1 TypeWith window, belt + gear CVT[5]—
Platen 1 endpointFull scan and motor torque[5]—
Platen 1 slurry armStandard tunable[5]—
Platen 1 pad conditioner armStandard[5]—
Platen 2 TypeWith window, belt + gear CVT[5]—
Platen 2 endpointFull scan[5]—
Platen 2 slurry armStandard tunable[5]—
Platen 2 pad conditioner armStandard[5]—
Platen 3 TypeWith window, belt + gear CVT[5]—
Platen 3 endpointFull scan[5]—
Platen 3 slurry armStandard tunable[5]—
Platen 3 pad conditioner armStandard[5]—
Polishing head3 zone[5]—
Slurry Delivery2 types of slurry[5]—
ModelMirra Mesa[5]AvantGaard 776[4]
CategoryCMP (Chemical Mechanical Polisher)[5]CMP[4]
Slurry flow rate controlPeristaltic pump[5]—
FABs port3 Port[5]—
Electrical requirements50/60 HZ; 200-230V; three-phase four-wire[5]—
Cleaner quantity1 unit[5]—
Cleaner robotworking beam Megasonics Module[5]—
Cleaning methodVertical[5]—
Megasonics delivery type2 Chem flow meter type[5]—
Brush 1 clean1 Chem and DIW[5]—
Brush 1 flow typeflow meter type[5]—
Brush 2 clean1 Chem and DIW[5]—
Brush 2 flow rateflow meter type[5]—
Dry typeSpin Dryer[5]—
DryingLamp heater Drying; N2 Drying[5]—
Line Frequency50/60 HZ[5]—
OEMApplied Materials[5]—
Facilities optionEMO Guard Ring[5]—
Line voltage200-230V[5]—
ConnectionThree-phase four-wire[5]—
Power lampGreen Lamp[5]—
Power connected lampPower Connected Lamp[5]—
GFI typeSTANDARD 30mA[5]—
Make—Lam / IPEC[3]
Wafer size—8 inch[3]
Wafer size (version)—200 mm[6]
Asset description—CMP system for spares use[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing
  5. [5]inventory listing
  6. [6]fabsurplus.comfabsurplus.com