Comparison ledger
Applied Materials EHP 500, Varian EHPI 500, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EHP 500Applied Materials | EHPI 500Varian |
|---|---|---|
| OEM | Applied Materials | Varian |
| Category | Ion Implantation | Ion Implantation |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials EHP 500 | Varian EHPI 500 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Medium Current[1] | Medium Current[4] |
| Wafer Size | 6 inch[1] | — |
| Type | Medium Current Implanter[3] | — |
| Manufacturer | Applied Materials / Varian[1] | Varian[6] |
| Model | EHP 500[1] | EHPI 500[6] |
| Category | Ion Implantation[3] | Ion Implantation[6] |
| Tool type | — | Medium current ion implanter[2] |
| Energy range (single charge, X+) | — | 5 – 260 keV[2] |
| Energy range (extended) | — | up to 780 keV[2] |
| Maximum wafer size | — | 200 mm (8 in)[2] |
| Minimum feature size | — | 0.18 µm[2] |
| Throughput | — | Highest industry throughput among medium current implanters (10% higher maximum throughput than previous E-series)[2] |
| Upgrade / Extensions | — | BDM (Beam Drift Monitors)[5] |
| Consumables at end of lifetime | — | source electrode[5] |
| Contamination Known | — | BF3, ASH 3, PH 3[5] |
| Energy range | — | up to 780 keV[2] |
| Wafer size | — | up to 200 mm[2] |
| Throughput increase | — | 10% higher maximum throughput[2] |
| Equipment type | — | Implanter[6] |
| Process class | — | Medium current ion implanter[4] |
| Expanded energy range | — | up to 780 keV[2] |
| Maximum throughput change | — | 10% higher maximum throughputs[2] |
| Feature size capability | — | down to 0.18 micron[2] |
| Wafer size capability | — | up to 200mm[2] |
| OEM | — | Varian[6] |
| Wafer sizes | — | 6 inch[7] |
| Current class | — | Medium Current[7] |
| Feature size | — | down to 0.18 micron[2] |
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