Comparison ledger
Applied Materials Centura RTP, Heller 1088, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura RTPApplied Materials | 1088Heller |
|---|---|---|
| OEM | Applied Materials | Heller |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2008 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura | Heller 1088 |
| Specifications | ||
| Configuration | (1)x DPN[1] | — |
| Wafer Sizes | 12 inch[1] | — |
| Chamber Configuration | 1x DPN, 2x RTP[1] | — |
| Vintage | 2008[1] | — |
| Heating Zones | — | 8 zones (4 top and 4 below) plus 1 cooling zone[2] |
| Heating Method | — | Forced convection[2] |
| Conveyor Width | — | 18 inches (45 cm)[2] |
| Heated Length | — | 43.5 inches (111 cm)[2] |
| Overall Length | — | 96 inches (244 cm)[2] |
| Height | — | 50 inches (127 cm)[2] |
| Net Weight | — | 900 lbs (409 kg)[2] |
| Thermal Profiler | — | Included[2] |
| Oven Top | — | Counter balance for easy access to conveyor[2] |
| Solder Compatibility | — | Lead-free and leaded soldering[2] |
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