Waferpedia

Comparison ledger

Centura AP eMax CT+versus1512e

Applied Materials Centura AP eMax CT+, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura AP eMax CT+Applied Materials
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura AP eMax CT+Tegal 1512e
Specifications
Wafer size300 mm[1]—
Chamber configuration3 chambers[1]—
Vintage year2007[2]—
Process typeOxide etch[1]—
ManufacturerApplied Materials[3]—
ModelCentura AP eMax CT+[3]—
Tool typeEtcher[3]Industrial RIE plasma etcher system[4]
ApplicationSemiconductor manufacturing[2]—
Vintage01.06.2007[1]—
Stated configuration—With modules assembly for CI-4222[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]semistarcorp.comsemistarcorp.com