Comparison ledger
Applied Materials 0720 06060 Part, Electroglas EG 4090, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | EG 4090Electroglas |
|---|---|---|
| OEM | Applied Materials | Electroglas |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Electroglas EG 4090 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[2] | with Agilent 4071[3] |
| Equipment type | — | PCM Tester[3] |
| Associated wafer size | — | 200 mm[1] |
| Probe family description | — | Thin wafer probers[1] |
| Stated performance focus | — | Fast probing for high throughput of small die[1] |
| Related instrument | — | Agilent 4071[3] |
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