Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Palomar 9000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 9000Palomar |
|---|---|---|
| OEM | Applied Materials | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Palomar 9000 |
| Specifications | ||
| Machine type | — | High-speed fine wire wedge and ribbon bonder[1] |
| Bond head drive technology | — | Voice coil technology[1] |
| Wedge clamps | — | Interchangeable 45-60° and 90° deep access wedge clamps[1] |
| Work area | — | 304 x 152 mm[1] |
| Bond head motion note | — | The entire bond head mechanism rides on theta[1] |
| Bond head technology | — | Voice coil technology[1] |
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