Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps BJ 855, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | BJ 855Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps (H&K) BJ 855 |
| Specifications | ||
| Configuration | — | 60° Bondhead[1] |
| Model | — | BJ 855[1] |
| Type | — | Wire Bonder[1] |
| Bonding type | — | High Speed Fully Automatic Fine Wire Bonder[2] |
| Bondhead types | — | Wedge-wedge and ball-wedge[2] |
| Working area | — | 305 mm x 410 mm x 19 mm[2] |
| Working area X/Y | — | X: 305 mm; Y: 410 mm[3] |
| Z stroke | — | 32 mm[3] |
| P rotation | — | 440°[3] |
| Speed | — | Up to 7 wires per second[2] |
| Wire size | — | Al, Au, Ag, Pt: 12.5 µm to 75 µm[2] |
| Ribbon size | — | Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm[2] |
| Wire feed angles | — | 45°, 60°, 90°[2] |
| Footprint | — | 740 mm x 1484 mm x 1912 mm[2] |
| Weight | — | ca. 1150 kg[2] |
| Power supply | — | 230V AC[2] |
| Media connectivity | — | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air (CDA clean, dry air), vacuum[2] |
| Applications | — | HF and RF technology, COB, MCM, hybrids, optical, and automotive electronics[2] |
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