Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 540, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 540EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 540 |
| Specifications | ||
| Configuration | — | Anodic bond, fusion bond, adhesive bond[1] |
| Wafer sizes | — | 6, 8 inch[1] |
| Maximum substrate size | — | 300 mm[2] |
| Bond force | — | up to 350 kN[2] |
| Bonding types | — | Anodic bond, fusion bond, adhesive bond[1] |
| Automation | — | Semi automatic (4 stations) / Fully automated single-chamber[3] |
| Bond tools included | — | (4x) 8" tools, (4x) 6" tools, (1x) 4" tool[1] |
| Maximum bond chambers | — | 1[2] |
| Compatible alignment systems | — | SmartView and MBA300[2] |
| Maximum heater size | — | 300 mm[2] |
| Loading chamber | — | 2-axis robot[2] |
| Max. bond chambers | — | 1[2] |
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