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0041-26723 Bonded AssemblyversusAD 838 L

Applied Materials 0041-26723 Bonded Assembly, ASM AD 838 L, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0041-26723 Bonded AssemblyApplied Materials
AD 838 LASM
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer Loader
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM AD 838
Cited variants—
  • AD 838 L G 2[1]
  • ASM AD 838 L G 2[1]
Specifications
Configuration—50/60 Hz[2]
Voltage—230 Vac[2]
Phase—1 Phase[2]
Power Consumption—1300 w[4]
Wafer size—Wafer Loader[5]
Power—1300 w[6]
Frequency—50/60 Hz[7]
Wafer Sizes—6 inch, 8 inch[1]
0041-26723 Bonded Assembly entryAD 838 L entryAsk about these tools →Share experience with this comparison →

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Sources (7)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]Equipment inventory listing