Waferpedia

Comparison ledger

0010-22161 High EFF RF MatchversusHR 8500 II

Applied Materials 0010-22161 High EFF RF Match, Nitto HR 8500 II, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsNitto
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchNitto HR 8500 II
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Control system—PLC based system[3]
Wafer size—4/5/6/8 inch[4]
Applicable wafer thickness—300-1000um[4]
Power supply—110V[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]wotol.comwotol.com