Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Ulvac NE 950, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | NE 950Ulvac |
|---|---|---|
| OEM | Applied Materials | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Ulvac NE 950 |
| Cited variants | — | |
| Specifications | ||
| OEM | Applied Materials[2] | — |
| Model | 0010-16392[2] | NE 950[4] |
| Type | ESC Assembly[2] | — |
| Wafer Size | 300 mm[3] | — |
| Electrode Configuration | Dual[3] | — |
| Manufacturer | — | Ulvac[4] |
| Category | — | Etch[5] |
| Tool type | — | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system[5] |
| Wafer description | — | chamber described for 2" to 12" wafers[5] |
| Process type | — | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch)[5] |
| Wafer size | — | 2" to 12" wafers[5] |
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