Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusDPS Metal

Applied Materials 0010-16392 ESC Assembly, Applied Materials DPS Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
DPS MetalApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyApplied Materials DPS Metal
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Wafer size—200 mm (8 inch)[3]
Plasma type—inductively coupled plasma (ICP)[4]
Chamber wall material—anodized aluminum[4]
Chamber dome material—alumina[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]Equipment inventory listing
  4. [4]osti.govosti.gov