Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Axcela, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | AxcelaApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Axcela |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | 7 System[2] |
| Model | 0010-13622[1] | Axcela[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Tables | — | 5 x 300 mm (no backside)[2] |
| Wafer size capability | — | 150mm, 200mm, 300mm[3] |
| Film thickness uniformity | — | < 2%[3] |
| Maximum film thickness | — | 8 µm[3] |
| Maximum chambers | — | 4[3] |
| Process type | — | Physical Vapor Deposition (PVD)[4] |
| OEM | — | Applied Materials[2] |
| Wafer sizes | — | 8, 12 inch[2] |
| Wafer diameter processing | — | 150/200/300mm[3] |
| Chambers | — | 4 chambers max[3] |
| Thickness uniformity | — | <2%[3] |
| Interfaces | — | SECS/GEM, GEM 300[2] |
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