Waferpedia

Comparison ledger

0010-03254 E Chuckversus2300C/D

Applied Materials 0010-03254 E Chuck, Varian 2300C/D, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
2300C/DVarian
OEMApplied MaterialsVarian
Category——
Wafer size——
Process node——
Introduced——
Production run—1987–2007
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Varian 2300C/D
Specifications
Power source—Klystron[1]
Photon energy configuration—6 & 10/15/18/25 MV[1]
Maximum dose rate (photons)—600 MU/min[1]
Electron energies—Yes[1]
Maximum dose rate (electrons)—1000 MU/min[1]
Multi-leaf collimator (MLC)—80 leaves (field size 40x40 cm); 120 leaves available (field size 40x40 cm, central 20 cm 5 mm leaf width, outer 20 cm 10 mm leaf width)[1]
Portal imager (EPID)—LC250, aS500, aS1000 (optional)[1]
kV imaging for IGRT—OBI (optional)[1]
Cone-beam CT—Only with OBI[1]
Treatment delivery—3D, IMRT, SRS/SBRT (optional)[1]
Stereotactic radiosurgery—Optional cones or mMLC[1]
Treatment couch—Exact ETR, Exact (optional)[1]
iCBCT—No[1]
ART (adaptive radiotherapy)—No[1]
VMAT—Only with OBI[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]oncologysystems.comoncologysystems.com