Comparison ledger
Tegal 900e, Tegal 981, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 900eTegal | 981Tegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | 1999 |
| Production run | — | 1999– |
| Lifecycle | — | Legacy |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 900e | Tegal 981 |
| Cited variants |
| |
| Specifications | ||
| Tool type | single wafer cassette-to-cassette etch system[1] | — |
| Process | non-critical plasma etch processes[1] | — |
| Wafer size | 3 in to 150 mm wafers[1] | — |
| Control system | Advanced Control System (ACS) field upgrades available for customers already invested in the Tegal 900e Series[1] | — |
| process type | — | plasma etch system[3] |
| application focus | — | thin film head fabrication[4] |
| etch result | — | precise photoresist descum[3] |
| anisotropy | — | 4:1[3] |
| processing temperature | — | low processing temperatures[3] |
| plasma chemistry | — | oxygen-free plasmas[3] |
| wafer size variant | — | 150mm–200mm[2] |
| Status | — | In Storage 8"[5] |
| Process type | — | plasma etch[3] |
| Primary function | — | precise photoresist descum[3] |
| Variant designation | — | 981 ACS[2] |
| Variant wafer size | — | 150mm–200mm[2] |
| Variant application | — | non-critical silicon nitride and photoresist trim processing[2] |
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