Waferpedia

Comparison ledger

1512eversusTSP 305 SCCM SE+ Oxide

Tegal 1512e, Tokyo Electron TSP 305 SCCM SE+ Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1512eTokyo Electron TSP 305 SCCM SE+ Oxide
Specifications
Tool typeIndustrial RIE plasma etcher system[1]—
Stated configurationWith modules assembly for CI-4222[1]—
Vintage—2006, 2007, 2008[2]
Wafer Size—12"[3]
Carrier—FOUP (Comply with SEMI E47.1, 25 wafers)[3]
Interface—5 Carrier stage (Continuous flow operation) with Semi compliant MENV and FIMS assemblies[3]
Process Chambers—4 chambers, SCCM Oxide with Y2O3 coating[3]
End Point Detector—SE2000ii[3]
ESC Type—Ceramics ESC with STD Vpp[3]
Focus Ring—3.4mm[3]
TMP—TMP-3403LMC-T4(VG300) (SHIMADZU)[3]
Dry Pump—ESR80WN, KEG approved[3]
APC—Pendulum Motion Dia., 320mm(VAT), R.T.~90deg[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]Equipment inventory listing
  3. [3]achilles-tech.comachilles-tech.com