SUSS MicroTec
XBC300 Gen2 D2W/W2W alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Logitech
1 WBS 1 Wafer Substrate
Packaging & Bonding
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
Branson
101-149-053 Gold Booster
Packaging & Bonding
The Branson 101-149-053 Gold Booster is an ultrasonic welding horn booster that doubles the amplitude of the vibration, operating at 20 kHz.
West Bond
10100
Packaging & Bonding
West Bond
10490
Packaging & Bonding
The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare XBC300 Gen2 D2W/W2W with another model →