Waferpedia

Comparison ledger

RC 8 MS 3 Spinversus1000P

SUSS MicroTec RC 8 MS 3 Spin, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
RC 8 MS 3 SpinSUSS MicroTec
OEMSUSS MicroTecYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilySUSS MicroTec RC 8 MS 3 SpinYES 1000P
Specifications
Frequency50 Hz[1]—
Voltage220 V[1]—
ConfigurationWith controller[1]Parallel plate[4]
Does not include add-ons (exedge bead removal / dispense and autoclean)[1]—
TypeSpin coater[1]—
Vintage2001[2]—
ControllerWith controller[1]—
High Gyrset3, 5 and 8[2]—
Air4-9 bar[2]—
Vacuum-0.6 bar[2]—
Model—1000P[3]
System type—Plasma cleaning system[3]
Shelf configuration—Four 16 x 16 inch shelves[3]
Total capacity—1024 square inches[3]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[3]
Number of shelves—4[3]
Shelf size—16 x 16 inches[3]
Power—1000 W[4]
Operation modes—Active, RIE, Downstream[3]
Sample size range—From smallest semiconductor chip to large flat panels[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]web.archive.orgweb.archive.org
  4. [4]semistarcorp.comsemistarcorp.com