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Comparison ledger

100R16versusXU RSM 53 E 0 Atmospheric Wafer Robot

Strasbaugh 100R16, Yaskawa XU RSM 53 E 0 Atmospheric Wafer Robot, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100R16Strasbaugh
OEMStrasbaughYaskawa
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyStrasbaugh 100R16Yaskawa XU RSM 53 E 0 Atmospheric Wafer Robot
Specifications
type1 spindle grinder/polisher[1]—
drive systemDC drive system with 2 motors[1]—
spindle RPM1-180 RPM[1]—
eccentric RPM1-90 RPM[1]—
controlsdigital timer; air down switch; spindle and eccentric speed dials; air regulators[1]—
capacity16 inches[1]—
spindle size1-8 TPI[1]—
overall dimensions28 inches x 36 inches x 48 inches[1]—
weight500 lbs[1]—
originmade in the USA[1]—
Configuration—With XU-CM6180 Controller, Compatible with Ebara FREX 300 CMP[2]
Model—XU RSM 53 E 0[2]
Equipment type—Atmospheric Wafer Robot[2]
Category—CMP[3]
Wafer size—12 inch[2]
Controller—XU-CM6180 Controller[3]
Compatibility—Compatible with Ebara FREX 300 CMP[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]excelltechnology.comexcelltechnology.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com